Theses Doctoral

High Density CMOS-based Ultrasound Phased Array with Monolithically Fabricated Piezoelectric Transducers for Photoacoustic Imaging

Arslan, Volkan

Ultrasound imaging is among the most widely utilized diagnostic modalities due to its reliance on non-ionizing radiation and the accessibility of low-cost hardware implementations. Recent advancements have focused on achieving further miniaturization, enhanced power efficiency, and improved spatial resolution. The monolithic co-design of ultrasound transducers with complementary metal-oxide-semiconductor (CMOS) electronics represents a critical step toward realizing compact, high-density array architectures. This work presents a scalable, CMOS-compatible integration strategy for polyvinylidene fluoride (PVDF) transducers and front-end circuitry optimized for high-resolution operation.

By reducing interconnect length, suppressing capacitive parasitics, and minimizing the input capacitance of receiver amplifiers, the proposed architecture enables high-fractional-bandwidth transduction suitable for advanced imaging applications. The fabricated array comprises 206 receiver elements, each measuring 30 µm x 25 µm x 5.5 µm, corresponding to a volumetric reduction of over two orders of magnitude compared to conventional ceramic piezoelectric transducers. Device performance is validated through in-vitro and in-vivo photoacoustic imaging experiments, achieving lateral and axial resolutions better than 30 µm and 15 µm, respectively. The demonstrated fabrication and integration approach, together with co-designed electronics on thinned CMOS substrates, establishes a pathway toward scalable, high-density, and mechanically flexible two-dimensional ultra-high-resolution transducer arrays.

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More About This Work

Academic Units
Electrical Engineering
Thesis Advisors
Shepard, Kenneth L.
Degree
Ph.D., Columbia University
Published Here
August 19, 2026

Notes

Electrical Engineering, CMOS, Ultrasound Imaging, PVDF, Photoacoustic Imaging